Siemens SIMATIC Distributed I/O System DP/ASi Link Spezifikationen

Preface, ContentsProduct Overview1Getting Started2Configuration Options with theET 200M3Installation4Wiring5Commissioning and Diagnostics6Maintenance7

ContentsxDistributed I/O Device ET 200MEWA-4NEB780600602-063.7 Clock Synchronism 3-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Wiring5-14Distributed I/O Device ET 200MEWA-4NEB780600602-06Table 5-3 Wiring rules for module front connectors Wiring Rules for ... Module Front Conne

Wiring5-15Distributed I/O Device ET 200MEWA-4NEB780600602-065.2.2 Wiring the Power Supply and IM 153-xPower CablesTo wire the power supply, use flexib

Wiring5-16Distributed I/O Device ET 200MEWA-4NEB780600602-06Wiring with the JumperTo wire the power supply module and IM 153-x, proceed as follows (se

Wiring5-17Distributed I/O Device ET 200MEWA-4NEB780600602-065.2.3 Wiring the Front Connectors of the Signal ModulesS7 Explosion-Proof ModulesYou can f

Wiring5-18Distributed I/O Device ET 200MEWA-4NEB780600602-06Preparing the Connector for WiringTo prepare for wiring, proceed as follows:!WarningAccide

Wiring5-19Distributed I/O Device ET 200MEWA-4NEB780600602-06Wiring the Front ConnectorTable 5-4 Wiring the front connector Step 20-Pin Front Connecto

Wiring5-20Distributed I/O Device ET 200MEWA-4NEB780600602-06Preparing the Signal Module for OperationTable 5-5 Preparing the signal module for operati

Wiring5-21Distributed I/O Device ET 200MEWA-4NEB780600602-065.2.4 Connecting Shielded Cables via a Shield Contact ElementIntroductionThis section tell

Wiring5-22Distributed I/O Device ET 200MEWA-4NEB780600602-06Installing the Shield Contact ElementInstall the shield contact element as follows:1. Push

6-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Commissioning and DiagnosticsChapter OverviewSection Subject Page6.1 Commissioning and Startup of

ContentsxiDistributed I/O Device ET 200MEWA-4NEB780600602-066.4.3 Master PROFIBUS Address 6-21. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Commissioning and Diagnostics6-2Distributed I/O Device ET 200MEWA-4NEB780600602-066.1.1 Prerequisites for CommissioningSoftware PrerequisitesTable 6-1

Commissioning and Diagnostics6-3Distributed I/O Device ET 200MEWA-4NEB780600602-06Prerequisites for CommissioningTable 6-2 Commissioning prerequisites

Commissioning and Diagnostics6-4Distributed I/O Device ET 200MEWA-4NEB780600602-066.1.2 Startup of the IM 153-1Switch on the supplyvoltage for the DP

Commissioning and Diagnostics6-5Distributed I/O Device ET 200MEWA-4NEB780600602-066.1.3 Startup of the IM 153-2/153-2 FOThe designation IM 153-2 in th

Commissioning and Diagnostics6-6Distributed I/O Device ET 200MEWA-4NEB780600602-06Has the IM 153-2 (b) already received configuration data from the DP

Commissioning and Diagnostics6-7Distributed I/O Device ET 200MEWA-4NEB780600602-06Startup for Time Synchronization/Time Stamping of Signal ChangesIs t

Commissioning and Diagnostics6-8Distributed I/O Device ET 200MEWA-4NEB780600602-066.1.4 PROFIBUS-DPV1 ModeThe ET 200M fulfills the requirements of DPV

Commissioning and Diagnostics6-9Distributed I/O Device ET 200MEWA-4NEB780600602-06Actions Following Diagnostic Message in S7 or DPV1 ModeEvery diagnos

Commissioning and Diagnostics6-10Distributed I/O Device ET 200MEWA-4NEB780600602-066.2 Diagnostics Using LEDsIM 153-1Table 6-5 Status and error LEDs o

Commissioning and Diagnostics6-11Distributed I/O Device ET 200MEWA-4NEB780600602-06IM 153-2Table 6-6 Status and error messages of the IM 153-2SFBFONAC

ContentsxiiDistributed I/O Device ET 200MEWA-4NEB780600602-06Figures1-1 Typical PROFIBUS-DP network structure 1-3. . . . . . . . . . . . . . . . . . .

Commissioning and Diagnostics6-12Distributed I/O Device ET 200MEWA-4NEB780600602-06Table 6-6 Status and error messages of the IM 153-2SFBFONACTSF (gro

Commissioning and Diagnostics6-13Distributed I/O Device ET 200MEWA-4NEB780600602-066.3 Diagnostics Using STEP 7 and STEP 5Slave DiagnosticsThe slave

Commissioning and Diagnostics6-14Distributed I/O Device ET 200MEWA-4NEB780600602-06Example of Displaying the S7 Diagnosis Using SFC 13 ”DPNRM_DG”Here

Commissioning and Diagnostics6-15Distributed I/O Device ET 200MEWA-4NEB780600602-06Example of Displaying the Slave Diagnosis with FB 192 ”IM308C”Here

Commissioning and Diagnostics6-16Distributed I/O Device ET 200MEWA-4NEB780600602-066.4 Structure of the DiagnosisIntroductionThe IM 153-x makes the st

Commissioning and Diagnostics6-17Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.1 Structure of the Slave DiagnosisNotes on Enhanced DiagnosisTo

Commissioning and Diagnostics6-18Distributed I/O Device ET 200MEWA-4NEB780600602-06Structure of the Slave DiagnosisByte 0Byte 1Station statuses 1 to 3

Commissioning and Diagnostics6-19Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.2 Station Statuses 1 to 3DefinitionStation statuses 1 to 3 prov

Commissioning and Diagnostics6-20Distributed I/O Device ET 200MEWA-4NEB780600602-06Table 6-8 Structure of station status 1 (Byte 0), continuedBit Caus

Commissioning and Diagnostics6-21Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.3 Master PROFIBUS AddressDefinitionThe master PROFIBUS address

ContentsxiiiDistributed I/O Device ET 200MEWA-4NEB780600602-066-9 Structure of the H status of the IM 153-2 (only for S7-400H) 6-28. . . . . . . . . .

Commissioning and Diagnostics6-22Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.5 Module DiagnosisDefinitionThe module diagnosis indicates whet

Commissioning and Diagnostics6-23Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.6 Module StatusDefinitionThe module status indicates the status

Commissioning and Diagnostics6-24Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.7 Channel-Specific DiagnosisDefinitionThe channel-specific diag

Commissioning and Diagnostics6-25Distributed I/O Device ET 200MEWA-4NEB780600602-067Bit no.10654 132000001B to 001010B: ID number of the module that d

Commissioning and Diagnostics6-26Distributed I/O Device ET 200MEWA-4NEB780600602-06Channel-Specific Error MessagesTable 6-12 Channel-specific error me

Commissioning and Diagnostics6-27Distributed I/O Device ET 200MEWA-4NEB780600602-06Table 6-13 Channel-specific error messages – manufacturer-specificE

Commissioning and Diagnostics6-28Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.8 H Status (with S7-400H and Standard Redundancy Only)The IM 15

Commissioning and Diagnostics6-29Distributed I/O Device ET 200MEWA-4NEB780600602-066.4.9 InterruptsDefinitionThe interrupts section of the slave diagn

Commissioning and Diagnostics6-30Distributed I/O Device ET 200MEWA-4NEB780600602-06Removal and Insertion InterruptsTo remove and insert modules during

Commissioning and Diagnostics6-31Distributed I/O Device ET 200MEWA-4NEB780600602-06InterruptsThe interrupt section for the ET 200M is structured as fo

ContentsxivDistributed I/O Device ET 200MEWA-4NEB780600602-067-2 Installing new modules 7-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Commissioning and Diagnostics6-32Distributed I/O Device ET 200MEWA-4NEB780600602-06Diagnostic Interrupt, Bytes x+4 to x+7Bytes x+4 to x+7 correspond t

Commissioning and Diagnostics6-33Distributed I/O Device ET 200MEWA-4NEB780600602-06Diagnostic Interrupt of Modules with Digital InputsByte x+870H: Mod

Commissioning and Diagnostics6-34Distributed I/O Device ET 200MEWA-4NEB780600602-06Diagnostic Interrupt of Modules with Digital OutputsByte x+87072H:

Commissioning and Diagnostics6-35Distributed I/O Device ET 200MEWA-4NEB780600602-06Diagnostic Interrupt of Modules with Analog Inputs71H: Module with

Commissioning and Diagnostics6-36Distributed I/O Device ET 200MEWA-4NEB780600602-06Diagnostic Interrupt of Modules with Analog Outputs73H: Module with

Commissioning and Diagnostics6-37Distributed I/O Device ET 200MEWA-4NEB780600602-06Process Interrupt of Analog Input ModulesByte x+4Upper limit violat

Commissioning and Diagnostics6-38Distributed I/O Device ET 200MEWA-4NEB780600602-06Module Removal/Insertion InterruptThe module ID that was removed or

Commissioning and Diagnostics6-39Distributed I/O Device ET 200MEWA-4NEB780600602-06Removal/Insertion Interrupt with S7/M7-DP Master or DPV1 MasterIf y

Commissioning and Diagnostics6-40Distributed I/O Device ET 200MEWA-4NEB780600602-06Interrupts with Another DP MasterIf you operate the ET 200M with an

7-1Distributed I/O Device ET 200MEWA-4NEB780600602-06MaintenanceMaintenanceThe ET 200M is a maintenance-free DP slave.Chapter OverviewIn this chapter

1-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Product OverviewIn This ChapterThe product overview tells you: How to incorporate the ET 200M di

Maintenance7-2Distributed I/O Device ET 200MEWA-4NEB780600602-06Removing the Power Supply ModuleTo remove the power supply module, proceed as follows:

Maintenance7-3Distributed I/O Device ET 200MEWA-4NEB780600602-067.2 Replacing the IM 153-1Initial SituationThe IM 153-1 is installed. You want to inst

Maintenance7-4Distributed I/O Device ET 200MEWA-4NEB780600602-06Installing a New ModuleInstall the new module as follows:1. Set the same DP address on

Maintenance7-5Distributed I/O Device ET 200MEWA-4NEB780600602-06IM 153-2: Unplugging the Bus ConnectorWith a looped-through interconnecting cable you

Maintenance7-6Distributed I/O Device ET 200MEWA-4NEB780600602-06In the Case of RedundancyNoteOnly replace the IM 153-2/-2 FO in a de-energized state!I

Maintenance7-7Distributed I/O Device ET 200MEWA-4NEB780600602-063. Disconnect the wiring.4. Remove the fixing screws of the IM 153-2/-2 FO.5. Swing th

Maintenance7-8Distributed I/O Device ET 200MEWA-4NEB780600602-067.4 Replacing Modules without the ”Module Change DuringOperation” FunctionRemoving a M

Maintenance7-9Distributed I/O Device ET 200MEWA-4NEB780600602-06Removing the Front Connector Coding KeyPrior to installing the new module, you must re

Maintenance7-10Distributed I/O Device ET 200MEWA-4NEB780600602-06Putting a New Module into ServiceTable 7-3 Putting new modules into service Step Putt

Maintenance7-11Distributed I/O Device ET 200MEWA-4NEB780600602-067.5 Replacing Modules with the ”Module Change DuringOperation” FunctionPrerequisitesY

Product Overview1-2Distributed I/O Device ET 200MEWA-4NEB780600602-06What Is PROFIBUS-DP?PROFIBUS-DP is an open bus system based on the IEC 61784-1:20

Maintenance7-12Distributed I/O Device ET 200MEWA-4NEB780600602-06Removing the Front Connector Coding KeyPrior to installing the new module, you must r

Maintenance7-13Distributed I/O Device ET 200MEWA-4NEB780600602-067.6 Replacing the Bus ModuleRemoving the Bus ModuleOnly remove bus modules if they ar

Maintenance7-14Distributed I/O Device ET 200MEWA-4NEB780600602-067.7 Changing Fuses in Digital Output ModulesFuses for Digital OutputsFuses are used f

Maintenance7-15Distributed I/O Device ET 200MEWA-4NEB780600602-06Changing FusesThe fuses are located at the left side of the module.1. Remove the digi

Maintenance7-16Distributed I/O Device ET 200MEWA-4NEB780600602-067.8 Update of the IM 153-x7.8.1 Update of the IM 153-1/-2Ax0xPlease contact your SIEM

Maintenance7-17Distributed I/O Device ET 200MEWA-4NEB780600602-06PrerequisitesFor update via PROFIBUS-DP  The IM 153-2 in the station which is to be

Maintenance7-18Distributed I/O Device ET 200MEWA-4NEB780600602-06Sample ConfigurationUpdate from the PG/PC via PROFIBUS-DP (Direct) The PG/PC with the

Maintenance7-19Distributed I/O Device ET 200MEWA-4NEB780600602-06Update via MMC You perform an update via MMC in the following way:Table 7-8 Update vi

Maintenance7-20Distributed I/O Device ET 200MEWA-4NEB780600602-06Update in the Redundant SystemIf the update of the active IM 153-2 is performed via P

8-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Technical SpecificationsIn This ChapterYou will find the following: The standards, certificates

Product Overview1-3Distributed I/O Device ET 200MEWA-4NEB780600602-06Structure of a PROFIBUS-DP NetworkThe figure below shows you a typical PROFIBUS-D

Technical Specifications8-2Distributed I/O Device ET 200MEWA-4NEB780600602-068.1 Standards, Certificates and ApprovalsCE ApprovalThe ET 200M distribut

Technical Specifications8-3Distributed I/O Device ET 200MEWA-4NEB780600602-06UL ApprovalUnderwriters Laboratories Inc. to UL 508 (Industrial Control

Technical Specifications8-4Distributed I/O Device ET 200MEWA-4NEB780600602-06FM ApprovalFactory Mutual Research (FM) toApproval Standard Class Number

Technical Specifications8-5Distributed I/O Device ET 200MEWA-4NEB780600602-06Ship-Building ApprovalClassification organizations: ABS (American Bureau

Technical Specifications8-6Distributed I/O Device ET 200MEWA-4NEB780600602-06Laser Safety Class Certification (for IM 153-2 FO)Class 1 to EN 60825-1:

Technical Specifications8-7Distributed I/O Device ET 200MEWA-4NEB780600602-068.2 Parameters of the IM 153-x Parameter AssignmentAssign parameters to t

Technical Specifications8-8Distributed I/O Device ET 200MEWA-4NEB780600602-06Parameters for Time StampingAssign parameters for time stamping with STEP

Technical Specifications8-9Distributed I/O Device ET 200MEWA-4NEB780600602-068.3 Technical SpecificationsGeneral Technical SpecificationsIn the Module

Technical Specifications8-10Distributed I/O Device ET 200MEWA-4NEB780600602-06Technical Specifications IM 153-2 F0IM 153-2IM 153-1Time Synchronization

Technical Specifications8-11Distributed I/O Device ET 200MEWA-4NEB780600602-06Dimensioned Drawing of the IM 153-1/-2/-2 FOYou can find a dimensioned d

Product Overview1-4Distributed I/O Device ET 200MEWA-4NEB780600602-061.2 What Is the ET 200M Distributed I/O Device?DefinitionThe ET 200M distributed

Technical Specifications8-12Distributed I/O Device ET 200MEWA-4NEB780600602-068.4 Time Delay of the ET 200MResponse Time – A DefinitionThe response ti

Technical Specifications8-13Distributed I/O Device ET 200MEWA-4NEB780600602-06Switchover Time in the Case of RedundancyThe switchover time depends on

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.1 Einsatz der ET 200M / S7-300 im explosions-gefährdeten Bereich Zone 2

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06InstandhaltungFür eine Reparatur muss die betroffene Baugruppe an den Fertig

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.2 Use of the ET 200M / S7-300 in a Zone 2Hazardous AreaZone 2Hazardous

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06MaintenanceIf repair is necessary, the affected module must be sent to the p

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.3 Utilisation de l'ET 200M / S7-300 dans unenvironnement à risque

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06EntretienSi une réparation est nécessaire, le module concerné doit être expé

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.4 Aplicación de la ET 200M / S7-300 en áreas conpeligro de explosión, z

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06MantenimientoPara una reparación se ha de remitir el módulo afectado al luga

Product Overview1-5Distributed I/O Device ET 200MEWA-4NEB780600602-06”SIMATIC S7-DP Slave”The ET 200M distributed I/O system is part of the SIMATIC S7

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.5 Impiego dell'ET 200M / S7-300 nell'area apericolo di esplos

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06ManutenzionePer una riparazione, l'unità interessata deve essere inviat

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.6 Gebruik van de ET 200M / S7-300 in hetexplosief gebied zone 2Zone 2Ex

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06InstandhoudingVoor een reparatie moet de betreffende module naar de plaats v

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.7 Brug af ET 200M / S7-300 i det eksplosionfarligeområde zone 2Zone 2Ek

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06VedligeholdelseSkal den pågældende komponent repareres, bedes De sende den t

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.8 ET 200M / S7-300:n käyttöräjähdysvaarannetuilla alueilla, vyöhyke 2Vy

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06KunnossapitoKorjausta varten täytyy kyseinen rakenneryhmä lähettää valmistus

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.9 Användning av ET 200M / S7-300 iexplosionsriskområde zon 2Zon 2Explos

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06UnderhållVid reparation måste den aktuella komponentgruppen insändas till ti

Index-2Distributed I/O Device ET 200MEWA-4NEB780600602-06!Dangerindicates that death, severe personal injury or substantial property damage will resul

Product Overview1-6Distributed I/O Device ET 200MEWA-4NEB780600602-06ComponentsThere are a number of components available for the setup and commission

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.10 Uso do ET 200M / S7-300 em área exposta aoperigo de explosão 2Zona 2

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06ReparoOs grupos construtivos em questão devem ser remetidos para o local de

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-068.5.11 Χρήση της συσκευής ET 200M / S7-300 σεεπικίνδυνη για έκρηξη περιοχή,

Technical SpecificationsDistributed I/O Device ET 200MEWA-4NEB780600602-06ΣυντήρησηΓια µια επισκευή πρέπει να σταλθεί το αντίστοιχο δοµικό συγκρότηµα

Technical Specifications8-14Distributed I/O Device ET 200MEWA-4NEB780600602-06

9-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Compatibility Between the IM 153-xModulesIn This Chapter... You can find all the important inform

Compatibility Between the IM 153-x Modules9-2Distributed I/O Device ET 200MEWA-4NEB780600602-069.1 Compatibility Between the Versions of the IM 153 an

Compatibility Between the IM 153-x Modules9-3Distributed I/O Device ET 200MEWA-4NEB780600602-06Response to the Removal/Insertion InterruptUp to153-1AA

Compatibility Between the IM 153-x Modules9-4Distributed I/O Device ET 200MEWA-4NEB780600602-06Configuration of the IM 153-1 with the General Identifi

Compatibility Between the IM 153-x Modules9-5Distributed I/O Device ET 200MEWA-4NEB780600602-069.2 Compatibility Between the Versions of the IM 153-2/

Product Overview1-7Distributed I/O Device ET 200MEWA-4NEB780600602-06Table 1-1 Components of an ET 200M, continuedComponent DrawingFunctionSignal modu

Compatibility Between the IM 153-x Modules9-6Distributed I/O Device ET 200MEWA-4NEB780600602-06UpgradingYou can upgrade the IM 153-2 (order number 6ES

Compatibility Between the IM 153-x Modules9-7Distributed I/O Device ET 200MEWA-4NEB780600602-06Configuration of the IM 153-2 with the General Identifi

Compatibility Between the IM 153-x Modules9-8Distributed I/O Device ET 200MEWA-4NEB780600602-069.3 RC Network with 1 MW for a Configuration withUngrou

A-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Order Numbers for the ET 200MComponents for the ET 200MTable A-1 Components for the ET 200M Acces

Order Numbers for the ET 200MA-2Distributed I/O Device ET 200MEWA-4NEB780600602-06Table A-1 Components for the ET 200M, continuedAccessories and Spare

Order Numbers for the ET 200MA-3Distributed I/O Device ET 200MEWA-4NEB780600602-06Table A-2 STEP 7 and SIMATIC S7 ManualsManual ContentsCommunication

Order Numbers for the ET 200MA-4Distributed I/O Device ET 200MEWA-4NEB780600602-06BooksTable A-4 Technical LiteratureTechnical guide ContentsDecentral

Glossary-1Distributed I/O Device ET 200MEWA-4NEB780600602-06GlossaryAutomation systemAn automation system is a ³ programmable logic controller consist

GlossaryGlossary-2Distributed I/O Device ET 200MEWA-4NEB780600602-06Chassis groundChassis ground refers to all the interconnected inactive parts of a

GlossaryGlossary-3Distributed I/O Device ET 200MEWA-4NEB780600602-06Device master fileAll slave-specific characteristics are stored in a device master

Product Overview1-8Distributed I/O Device ET 200MEWA-4NEB780600602-061.3 IM 153-x: Variants and FeaturesBrief Overview of the Different IM 153-xThe IM

GlossaryGlossary-4Distributed I/O Device ET 200MEWA-4NEB780600602-06DP slaveA ³ slave run on the PROFIBUS bus system with the PROFIBUS-DP protocoland

GlossaryGlossary-5Distributed I/O Device ET 200MEWA-4NEB780600602-06Functional groundingGrounding which has the sole purpose of safeguarding the inten

GlossaryGlossary-6Distributed I/O Device ET 200MEWA-4NEB780600602-06IP20Degree of protection to DIN 40050: Protection against contact with fingers and

GlossaryGlossary-7Distributed I/O Device ET 200MEWA-4NEB780600602-06Process interruptA process interrupt is triggered by S7-300 modules with interrupt

GlossaryGlossary-8Distributed I/O Device ET 200MEWA-4NEB780600602-06PROFIBUS-DPThis is the PROFIBUS bus system with the DP protocol. DP stands fordist

GlossaryGlossary-9Distributed I/O Device ET 200MEWA-4NEB780600602-06Response monitoringThis is a slave parameter. If a DP slave is not addressed withi

GlossaryGlossary-10Distributed I/O Device ET 200MEWA-4NEB780600602-06STEP 7Programming language for developing user programs for SIMATIC S7 PLCs.Subst

GlossaryGlossary-11Distributed I/O Device ET 200MEWA-4NEB780600602-06Time stampingBinary input signals are given a time stamp when they are changed. A

GlossaryGlossary-12Distributed I/O Device ET 200MEWA-4NEB780600602-06

Index-1Distributed I/O Device ET 200MEWA-4NEB780600602-06IndexNumbers24 V DC supply, 5-3AActive bus module, 1-6, 4-5Active bus modulesinstalling, 4-14

Product Overview1-9Distributed I/O Device ET 200MEWA-4NEB780600602-06Table 1-2 IM 153-x: features and variants Functions/Interface Module and Order N

IndexIndex-2Distributed I/O Device ET 200MEWA-4NEB780600602-06DDevice master file, Glossary-3on the Internet at ..., 1-4Diagnosis, 6-16channel-specifi

IndexIndex-3Distributed I/O Device ET 200MEWA-4NEB780600602-06General technical specifications. See ModuleSpecifications Reference ManualGround, Gloss

IndexIndex-4Distributed I/O Device ET 200MEWA-4NEB780600602-06JJumper, 5-15LLabeling strip, 5-20Laser safety class, 8-6LEDsIM 153-1, 6-10IM 153-2, 6-1

IndexIndex-5Distributed I/O Device ET 200MEWA-4NEB780600602-06RRadio interference, 5-3Rail, 1-6fixing holes, 4-10for active bus modules, 1-6, 4-8for m

IndexIndex-6Distributed I/O Device ET 200MEWA-4NEB780600602-06UUL, approval, 8-3Ungrounded, Glossary-11Ungrounded reference potential, 5-9Update, Glos

s Copyright  Siemens AG 2003 Subject to modifications Siemens Aktiengesellschaft SIMATIC Product Information Edition 11/2003 "Distributed

Copyright  Siemens AG 2003 All rights reserved Disclaimer of Liability Transmission as well as reproduction of this document, utilization and commu

Product Information for Distributed I/O Device ET 200M, Manual A5E00272208-01 3 1 On Section 1.3 and 9.2 Further information for IQ-Sense As from F

Product Information for Distributed I/O Device ET 200M, Manual 4 A5E00272208-01 3 On Section 3.7 Further information on the jitter The maximum ji

Product Information for Distributed I/O Device ET 200M, Manual A5E00272208-01 5 Further information on time calculation The following more precise eq

Product Overview1-10Distributed I/O Device ET 200MEWA-4NEB780600602-06Front View of IM 153-1 and IM 153-2AA02/-2AB01PROFI-BUS-DPPROFIBUS-DPinterface:9

Product Information for Distributed I/O Device ET 200M, Manual 6 A5E00272208-01 5 On Section 6.4.7 Information on channel-specific diagnosis Erro

Product Overview1-11Distributed I/O Device ET 200MEWA-4NEB780600602-06Front View of the IM 153-2Bx00PROFIBUS-DPinterface:9-pin socket or fiber-optic c

Product Overview1-12Distributed I/O Device ET 200MEWA-4NEB780600602-06

2-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Getting StartedChapter OverviewSection Subject Page2.1 Introduction 2-22.2 Order Numbers for the

Getting Started2-2Distributed I/O Device ET 200MEWA-4NEB780600602-062.1 IntroductionIn this chapter the following simple sample configuration will sho

Getting Started2-3Distributed I/O Device ET 200MEWA-4NEB780600602-062.2 Order Numbers for the Sample ConfigurationQuan-tityArticle Order number(Siemen

iiiDistributed I/O Device ET 200MEWA-4NEB780600602-06PrefacePurpose of the ManualThe information in this manual enables you to operate an IM 153 slave

Getting Started2-4Distributed I/O Device ET 200MEWA-4NEB780600602-062.3 Prerequisites You have set up an S7 station consisting of a power supply modu

Getting Started2-5Distributed I/O Device ET 200MEWA-4NEB780600602-062.5 WiringRail1. Connect the rail to the protective conductor. An M6 screw is prov

Getting Started2-6Distributed I/O Device ET 200MEWA-4NEB780600602-064. Wire the front connector of the DI in the following way:Terminal 1: L+ of PS; T

Getting Started2-7Distributed I/O Device ET 200MEWA-4NEB780600602-062.6 Putting Hardware into ServiceStep Activity Result1 Connect the programming dev

Getting Started2-8Distributed I/O Device ET 200MEWA-4NEB780600602-062.7 Configuration1. Start the SIMATIC Manager and create a new project with a DP m

Getting Started2-9Distributed I/O Device ET 200MEWA-4NEB780600602-065. Set the following parameters:– in the DP slave properties dialog box for ET 200

Getting Started2-10Distributed I/O Device ET 200MEWA-4NEB780600602-062.8 Integration into the User Program1. Create the user program in the LAD/STL/FB

Getting Started2-11Distributed I/O Device ET 200MEWA-4NEB780600602-062.10 Diagnostics1. If a fault occurs, the OB 82 is started. Evaluate the start in

Getting Started2-12Distributed I/O Device ET 200MEWA-4NEB780600602-06SM 322: Short Circuit to L+1. Open the front door of the DO module and use a wire

3-1Distributed I/O Device ET 200MEWA-4NEB780600602-06Configuration Options with the ET 200MThis chapter shows you when to use which IM 153-x for what

PrefaceivDistributed I/O Device ET 200MEWA-4NEB780600602-06Changes Since the Previous VersionThe following changes have been made since the previous v

Configuration Options with the ET 200M3-2Distributed I/O Device ET 200MEWA-4NEB780600602-063.1 Distributed I/Os with the IM 153-1The IM 153-1 is the s

Configuration Options with the ET 200M3-3Distributed I/O Device ET 200MEWA-4NEB780600602-063.2 Forwarding Parameterization Data from the PG/PC withthe

Configuration Options with the ET 200M3-4Distributed I/O Device ET 200MEWA-4NEB780600602-063.3 Parameterizable FM in a Configuration with an IM 153-2S

Configuration Options with the ET 200M3-5Distributed I/O Device ET 200MEWA-4NEB780600602-063.4 Time Stamping with the IM153-2Time stamping with IM 153

Configuration Options with the ET 200M3-6Distributed I/O Device ET 200MEWA-4NEB780600602-063.4.1 Time Stamping with 10 ms AccuracyThe time stamping of

Configuration Options with the ET 200M3-7Distributed I/O Device ET 200MEWA-4NEB780600602-06In the Redundant SystemThe IM 153-2 also supports the time

Configuration Options with the ET 200M3-8Distributed I/O Device ET 200MEWA-4NEB780600602-063.4.2 Time Stamping with 3 ms AccuracyPrerequisitesThe foll

Configuration Options with the ET 200M3-9Distributed I/O Device ET 200MEWA-4NEB780600602-063.5 Redundancy with the IM 153-2You can operate the IM 153-

Configuration Options with the ET 200M3-10Distributed I/O Device ET 200MEWA-4NEB780600602-06Sample Configuration of a Redundant DP Master System and t

Configuration Options with the ET 200M3-11Distributed I/O Device ET 200MEWA-4NEB780600602-06S5-115H/155H as DP MasterIf you use the IM 153-2 on an S5-

PrefacevDistributed I/O Device ET 200MEWA-4NEB780600602-06Position in the Information LandscapeThis delivery package (order number 6ES7 153-1AA00-8BA0

Configuration Options with the ET 200M3-12Distributed I/O Device ET 200MEWA-4NEB780600602-06Configuration with Device Master FilePrincipleWith the IM

Configuration Options with the ET 200M3-13Distributed I/O Device ET 200MEWA-4NEB780600602-06Configuration modification procedureReconfiguration is per

Configuration Options with the ET 200M3-14Distributed I/O Device ET 200MEWA-4NEB780600602-06AttentionIt is the user’s responsibility to ensure that th

Configuration Options with the ET 200M3-15Distributed I/O Device ET 200MEWA-4NEB780600602-063.7 Clock SynchronismReproducible response times (i.e. res

Configuration Options with the ET 200M3-16Distributed I/O Device ET 200MEWA-4NEB780600602-06Prerequisites Interface module IM 153-2; Order number 6ES

Configuration Options with the ET 200M3-17Distributed I/O Device ET 200MEWA-4NEB780600602-06Procedure for Parameterizing Clock Synchronism1. Settings

Configuration Options with the ET 200M3-18Distributed I/O Device ET 200MEWA-4NEB780600602-062. Settings at the DP master system:”Object Properties” of

Configuration Options with the ET 200M3-19Distributed I/O Device ET 200MEWA-4NEB780600602-063. Settings at the DP slave:”Object Properties” of the DP

Configuration Options with the ET 200M3-20Distributed I/O Device ET 200MEWA-4NEB780600602-06Time CalculationOnly the processes in the IM 153-2 interfa

Configuration Options with the ET 200M3-21Distributed I/O Device ET 200MEWA-4NEB780600602-06Internal Processes of the IM 153-2K[ms] +ȍ5m+1smkmS1= 1 k1

PrefaceviDistributed I/O Device ET 200MEWA-4NEB780600602-06CD-ROMYou can also obtain the complete set of ET 200 documentation on CD-ROM.Order number o

Configuration Options with the ET 200M3-22Distributed I/O Device ET 200MEWA-4NEB780600602-063.8 Identification DataIdentification data is information

Configuration Options with the ET 200M3-23Distributed I/O Device ET 200MEWA-4NEB780600602-062. The item of identification data assigned to the respect

Configuration Options with the ET 200M3-24Distributed I/O Device ET 200MEWA-4NEB780600602-06The identification data is assigned to the indices in the

Configuration Options with the ET 200M3-25Distributed I/O Device ET 200MEWA-4NEB780600602-063.9 Fiber-Optic Network with the IM 153-2 FOIn this sectio

Configuration Options with the ET 200M3-26Distributed I/O Device ET 200MEWA-4NEB780600602-063.10 Direct CommunicationAs of STEP 7 V 5.0 you can config

4-1Distributed I/O Device ET 200MEWA-4NEB780600602-06InstallationIntroductionIn this chapter we will show you how to carry out the mechanical configur

Installation4-2Distributed I/O Device ET 200MEWA-4NEB780600602-064.1 Mechanical ConfigurationIn This SectionSection Subject Page4.1.1 Horizontal and V

Installation4-3Distributed I/O Device ET 200MEWA-4NEB780600602-064.1.2 Clearance MeasurementsRulesIf you adhere to the minimum clearance measurements:

Installation4-4Distributed I/O Device ET 200MEWA-4NEB780600602-06Length of the RailsDepending on the ET 200M installation you have, you can use the fo

Installation4-5Distributed I/O Device ET 200MEWA-4NEB780600602-06Installation in an Intrinsically Safe AreaIf you use the ET 200M in intrinsically saf

PrefaceviiDistributed I/O Device ET 200MEWA-4NEB780600602-06Training CenterWe offer courses to introduce you to the ET 200 Distributed I/O System and

Installation4-6Distributed I/O Device ET 200MEWA-4NEB780600602-06 Use the rails for ”module change during operation” (only these can take theactive b

Installation4-7Distributed I/O Device ET 200MEWA-4NEB780600602-06Installation OptionsYou can install up to 9 active bus modules depending on the lengt

Installation4-8Distributed I/O Device ET 200MEWA-4NEB780600602-064.2 InstallationThere are two configuration types for the ET 200M: Standard configur

Installation4-9Distributed I/O Device ET 200MEWA-4NEB780600602-06Are you Installing a 2-Meter Rail?If not, you can skip this section and read on from

Installation4-10Distributed I/O Device ET 200MEWA-4NEB780600602-06Dimensioned Drawing for Fixing HolesThe fixing-hole dimensions for the rail are show

Installation4-11Distributed I/O Device ET 200MEWA-4NEB780600602-06Installing the RailTo install the rail, proceed as follows:1. Choose a position for

Installation4-12Distributed I/O Device ET 200MEWA-4NEB780600602-064.2.2 Standard Configuration (Installing Modules on the Rail)AccessoriesThe accessor

Installation4-13Distributed I/O Device ET 200MEWA-4NEB780600602-06Sequence for InstallationThe individual steps to be followed when installing the mod

Installation4-14Distributed I/O Device ET 200MEWA-4NEB780600602-064.2.3 Configuration with Active Bus Modules (Installing Active BusModules and Module

Installation4-15Distributed I/O Device ET 200MEWA-4NEB780600602-06Plugging in Output Modules During Operation of an ET 200M Installation!WarningWhen y

PrefaceviiiDistributed I/O Device ET 200MEWA-4NEB780600602-06Service & Support on the InternetIn addition to our range of printed documentation, o

Installation4-16Distributed I/O Device ET 200MEWA-4NEB780600602-06Applying Slot NumbersFigure 4-7 shows you how to apply the slot numbers. The slot nu

Installation4-17Distributed I/O Device ET 200MEWA-4NEB780600602-064.3 Connecting the Bus ConnectorThe following bus connectors are available: Up to 1

Installation4-18Distributed I/O Device ET 200MEWA-4NEB780600602-064.4 Connecting the Fiber-Optic Cable to the IM 153-2 FOAccessories Required: Pack o

Installation4-19Distributed I/O Device ET 200MEWA-4NEB780600602-06Reusing Fiber-Optic CablesNoteIf you insert used fiber-optic cables in the plug-in a

Installation4-20Distributed I/O Device ET 200MEWA-4NEB780600602-06Bending Radius for the Fiber-Optic CableMake sure when you wire the fiber-optic dupl

Installation4-21Distributed I/O Device ET 200MEWA-4NEB780600602-06Setting the PROFIBUS AddressSet the PROFIBUS address using a screwdriver and with th

Installation4-22Distributed I/O Device ET 200MEWA-4NEB780600602-06

5-1Distributed I/O Device ET 200MEWA-4NEB780600602-06WiringIntroductionIn this chapter we show you how to configure the electrical installation and ho

Wiring5-2Distributed I/O Device ET 200MEWA-4NEB780600602-065.1 Electrical ConfigurationSection Subject Page5.1.1 General Rules and Regulations on Oper

Wiring5-3Distributed I/O Device ET 200MEWA-4NEB780600602-06Note on Radio InterferenceWhen several electronic components are used within a switch cabin

ixDistributed I/O Device ET 200MEWA-4NEB780600602-06ContentsPreface1 Product Overview2.1 What Are Distributed I/O Devices? 1-1. . . . . . . . . . . .

Wiring5-4Distributed I/O Device ET 200MEWA-4NEB780600602-06Protection From External Electrical ExposureThe following table shows you what to remember

Wiring5-5Distributed I/O Device ET 200MEWA-4NEB780600602-065.1.2 Operating the ET 200M with Process I/O Modules on aGrounded SupplyThis section contai

Wiring5-6Distributed I/O Device ET 200MEWA-4NEB780600602-06Features of Load Power SuppliesThe load power supply feeds input and output circuits (load

Wiring5-7Distributed I/O Device ET 200MEWA-4NEB780600602-06ET 200M in the Overall ConfigurationFigure 5-1 shows you the position of the ET 200M in the

Wiring5-8Distributed I/O Device ET 200MEWA-4NEB780600602-06ET 200M with Load Power Supply from the PS 307Figure 5-2 shows the ET 200M in the overall c

Wiring5-9Distributed I/O Device ET 200MEWA-4NEB780600602-065.1.3 Configuring the ET 200M with Ungrounded Reference PotentialWhen the ET 200M is config

Wiring5-10Distributed I/O Device ET 200MEWA-4NEB780600602-06Filtering the 24V DC SupplyIf you supply the IM 153-x from a battery without grounding the

Wiring5-11Distributed I/O Device ET 200MEWA-4NEB780600602-06Configuration with Isolated ModulesFigure 5-4 shows the potentials of an ET 200M configura

Wiring5-12Distributed I/O Device ET 200MEWA-4NEB780600602-065.1.5 Configuring the ET 200M with Non-Isolated ModulesPotentials in a Configuration with

Wiring5-13Distributed I/O Device ET 200MEWA-4NEB780600602-065.2 WiringIn This ChapterSection Subject Page5.2.1 Wiring Rules 5-135.2.2 Wiring the Power