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9.6 Board to board connector and stacking height

The WISM connects to a motherboard by means of a board-to-board connector that is supplied by

Hirose. Mating headers from Hirose are available in different stacking heights, allowing the spacing

between the WISM module and carrier pcb to be changed from 3.5mm to 5.0mm.

Item Part number Stacking height HRS number

Receptacle on Module DF12C-50DS-0.5V(86) 3.5 mm – 5 mm CL537-0009-7-86

Headers DF12 series DF12(3.5)-50DP-0.5V(86) 3.5 mm CL537-0034-0-86

DF12(4.0)-50DP-0.5V(86) 4.0 mm CL537-0059-0-86

DF12(5.0)-50DP-0.5V(86) 5.0 mm CL537-0159-5-86

Notes: The headers listed above are with boss and metal fitting.

Suffix -86 denotes RoHS compliance.

9.7 Hirose Connector general specification

Parameter Specification (50 pin Board to Board connector)

Number of Contacts 50

Quantity delivered 2000 Connectors per Tape & Reel

Voltage 50V

Current Rating 0.5A max per contact

Resistance 0.05 Ohm per contact

Dielectric Withstanding Voltage 500V RMS min

Operating Temperature -45°C to +125°C

Contact Material phosphor bronze (surface: gold plated)

Insulator Material PA , beige natural

Stacking height 3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm

Insertion force 21.8N

Withdrawal force 1st to 50th 10N

Maximum connection cycles 50

See

http://www.hirose.co.jp/cataloge_hp/e53700036.pdf for detail information on the PCB socket.

9.8 Mounting the Module onto the application platform

There are many ways to properly install the Module in the host device. An efficient approach is to

mount the PCB to a frame, plate, rack or chassis. Fasteners can be M1.8 or M2 screws plus suitable

washers, circuit board spacers, or customized screws, clamps, or brackets in 2.2mm diameter holes.

Note that care should be taken to ensure the head of the fixing does not interfere with the circuit.

Nylon fixings are recommended.

The antenna (Brown square component on top side of PCB) must not be influenced by any other PCBs,

components or by the housing of the host device. The proximity of the antenna to large metallic objects

can affect the range and performance of the system. Designers should carefully consider the location of

the Module and the type of enclosure material that is used.

To prevent mechanical damage, be careful not to force, bend or twist the Module. Be sure it is

positioned flat against the host device.

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