
Technical Product Manual
Fault analysis and repairs 1318
3 Removing and fitting housing
Section 3: Removing and fitting housing • Edition 12/2005
TU00-1318-0200302 © Siemens VDO Trading GmbH Section 3 3–19
3.6.5.1 v board with laser-trimmed SMD resistors
Identification
EMC improved design in 4 multilayer positions with laser-trimmed plates (4) and SMD
balancing resistors (3).
Procedure
Unsolder SMD balancing resistors (3).
Solder non-balanced SMD resistors KN53.0272.301, R = 750Ω - 30%, to
position (3).
Solder potentiometer (5) HW11.461, R = 10 KOhm.
Using a knife disconnect the connectors to the left and right of positions (1)
and (2)
.
Using a screwdriver scrape off points at positions (1) and (2).
or
3.6.5.2 v board without laser-trimmed SMD resistors
Identification SMD resistors (3.1), traditional resistors (7), closed soldering points (6) and
conductors cut through at positions (1) and (2).
Procedure
Unsolder resistors (7).
Solder potentiometer (5) HW11.461, R = 10 KΩ.
Open solder bridges (6).
In this version the conductors in positions (1) and (2) are cut through.
Remark
Do not damage conductors.
Remark
Standard substitute balancing for faults with laser units.
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